Display assembly and manufacturing method thereof and display device

ABSTRACT

The present disclosure provides a display assembly, including: a display panel which includes: a screen portion, a chip providing portion, a bendable portion located between the screen portion and the chip providing portion, and a spacer portion connected between the bendable portion and the screen portion; a blocking layer on the screen portion; a cured adhesive layer located outside an area of the screen portion and including: a first portion covering the bendable portion and a second portion covering the spacer portion, the first portion and the second portion each having an thickness less than that of the blocking layer, the second portion is in contact with the blocking layer, and a surface of the second portion distal to the spacer portion is substantially flat. The present disclosure also provides a manufacturing method of the display assembly and a display device.

CROSS REFERENCE TO RELATED APPLICATION

This application is a National Phase Application filed under 35 U.S.C.371 as a national stage of PCT/CN2019/121544, filed on Nov. 28, 2019,the contents of which are incorporated herein by reference in theirentirety.

TECHNICAL FIELD

The present disclosure relates to the field of display technology, andin particular to a display assembly and a manufacturing method thereof,and a display device.

BACKGROUND

In a display device, one end of a display panel is bent to a backlightside for providing driving chips. In order to protect the bent portionof the display panel from being damaged, an adhesive is generally coatedon the bent portion and cured.

SUMMARY

An embodiment of the present disclosure provides a display assembly anda manufacturing method thereof, and a display device.

According to an aspect of the present disclosure, there is provided adisplay assembly including:

a display panel, including: a screen portion, a chip providing portion,a bendable portion between the screen portion and the chip providingportion, and a spacer portion between the bendable portion and thescreen portion;

a blocking layer on the screen portion;

a cured adhesive layer outside an area of the screen portion andincluding: a first portion covering the bendable portion and a secondportion covering the spacer portion, the first portion and the secondportion each having a thickness less than that of the blocking layer,wherein the second portion is in contact with the blocking layer, and asurface of the second portion distal to the spacer portion issubstantially flat.

In an embodiment, the cured adhesive layer further includes: a thirdportion on the chip providing portion, and a thickness of the thirdportion is gradually reduced along a direction far away from thebendable portion.

In an embodiment, a surface of the third portion distal to the spacerportion is a bevel.

In an embodiment, the cured adhesive layer further includes: a fourthportion on the chip providing portion, the fourth portion is connectedbetween the first portion and the third portion, and a surface of thefourth portion distal to the chip providing portion is substantiallyflat.

The bendable portion is in a bent state, and the chip providing portionis on a backlight side of the screen portion.

In an embodiment, the blocking layer is on a surface of the screenportion distal to the chip providing portion, a first back membrane isprovided on a surface of the screen portion proximal to the chipproviding portion, and the second portion of the cured adhesive layer atleast partially overlaps the first back membrane in a thicknessdirection of the screen portion.

In an embodiment, a boundary of the first portion of the cured adhesivelayer close to the bendable portion is flush with a boundary of thefirst back membrane close to the bendable portion.

In an embodiment, the chip providing portion has a first surface distalto the screen portion and a second surface proximal to the screenportion, a part of the cured adhesive layer is on the first surface ofthe chip providing portion, a second back membrane is on the secondsurface of the chip providing portion, and the cured adhesive layer onthe first surface of the chip providing portion at least partiallyoverlaps the second back membrane in a thickness direction of the chipproviding portion.

In an embodiment, a thickness of the first portion of the cured adhesivelayer is in a range of 60 μm to 120 μm.

In an embodiment, the second portion of the cured adhesive layer has athickness in a range of 60 μm to 90 μm.

In an embodiment, the blocking layer is a protection film.

In an embodiment, the blocking layer is a polarizer.

According to another aspect of the present disclosure, there is provideda display device including the display assembly according to anembodiment of the present disclosure.

According to further aspect of the present disclosure, there is provideda manufacturing method of a display assembly including the followingsteps:

preparing a display panel, the display panel including: a screenportion, a chip providing portion, a bendable portion located betweenthe screen portion and the chip providing portion, and a spacer portionconnected between the bendable portion and the screen portion;

forming a blocking layer on the screen portion;

forming an adhesive layer on the display panel;

curing the adhesive layer, wherein the cured adhesive layer is locatedoutside an area of the screen portion, and the cured adhesive layerincludes: a first portion covering the bendable portion and a secondportion covering the spacer portion, the first portion and the secondportion each having a in thickness less than that of the blocking layer,wherein the second portion is in contact with the blocking layer, and asurface of the second portion distal to the spacer portion issubstantially flat.

In an embodiment, the step of forming an adhesive layer on the displaypanel includes the following step: coating adhesive along a directionfrom the screen portion to the chip providing portion, starting from aposition adjacent to the blocking layer, to form the adhesive layer.

In an embodiment, the coating adhesive along a direction from the screenportion to the chip providing portion comprises coating adhesivestarting from the position adjacent to the blocking layer to an endposition located on the chip providing portion such that the curedadhesive layer further includes: a third portion provided on the chipproviding portion, and a thickness of the third portion is graduallyreduced along a direction far away from the bendable portion.

In an embodiment, the cured adhesive layer further includes: a fourthportion provided on the chip providing portion, wherein the fourthportion is connected between the first portion and the third portion, asurface of the fourth portion distal to the chip providing portion issubstantially flat.

In an embodiment, the step of curing the adhesive layer further includesthe following step:

bending the display panel along the bendable portion, so that the chipproviding portion is located on a backlight side of the screen portion,wherein the bendable portion is in a bent state.

In an embodiment, before the step of bending the display panel along thebendable portion, the method further includes the following step:

forming a first back membrane on a surface of the screen portion distalto the blocking layer, wherein the second portion of the cured adhesivelayer at least partially overlaps the first back membrane in a thicknessdirection of the screen portion.

In an embodiment, a part of the cured adhesive layer is located on afirst surface of the chip providing portion,

before the step of bending the display panel along the bendable portion,the method further includes the following step: forming a second backmembrane on a second surface of the chip providing portion, wherein thecured adhesive layer on the first surface of the chip providing portionat least partially overlaps the second back membrane in a thicknessdirection of the chip providing portion;

the bending the display panel along the bendable portion comprisesbending the display panel along the bendable portion such that the firstsurface of the chip providing portion is distal to the screen portion,and the second surface of the chip providing portion is proximal to thescreen portion.

BRIEF DESCRIPTION OF DRAWINGS

Accompanying drawings, which are included to provide a furtherunderstanding of the present disclosure and are incorporated in andconstitute a part of this specification, illustrate the presentdisclosure together with a following detailed description, and do notlimit the present disclosure. In the drawings:

FIG. 1 is a schematic diagram illustrating coating of an adhesive onto adisplay panel according to an embodiment.

FIG. 2 is a schematic diagram illustrating a distribution of theadhesive on the display panel after being cured according to anembodiment.

FIG. 3 is a schematic diagram illustrating the bent display panelaccording to an embodiment.

FIG. 4 a is a top view illustrating a display assembly according to anembodiment of the present disclosure.

FIG. 4 b is a cross-sectional view of the display assembly along a lineBB′ in FIG. 4 a.

FIGS. 5 to 10 are schematic diagrams illustrating a manufacturingprocedure of the display assembly according to an embodiment of thepresent disclosure.

FIG. 11 is a flowchart of a manufacturing method of a display assemblyaccording to an embodiment of the present disclosure.

FIG. 12 is a flowchart of a manufacturing method of a display assemblyaccording to an embodiment of the present disclosure.

DETAIL DESCRIPTION OF EMBODIMENTS

The detailed description of the embodiments of the present disclosurewill be described in details below in conjunction with the accompanyingdrawings. It should be understood that, the detailed description of theembodiments described herein is used only to illustrate and explain thepresent disclosure, not to limit the present disclosure.

FIG. 1 is a schematic diagram illustrating coating of an adhesive onto adisplay panel according to an embodiment. FIG. 2 is a schematic diagramillustrating a distribution of the adhesive on the display panel afterbeing cured according to an embodiment. FIG. 3 is a schematic diagramillustrating the bent display panel according to an embodiment. As shownin FIG. 1 , a protection film 21 is provided on a display panel 10, andthe protection film 21 covers a part of a display area AA and a part ofa non-display area NA. When coating an adhesive on the display panel 10,an adhesive coating device 40 applies the adhesive 30 a in an adhesivecoating area CA in a direction away from the display area AA, startingfrom a position X spaced a certain distance from the protection film 21.Then, as shown in FIG. 2 , the adhesive on the display panel 10 is curedto form a cured adhesive layer 30. Thereafter, as shown in FIG. 3 , apart of the display panel 10 may be bent to a backlight side of thedisplay area AA, thereby providing driving chips. The cured adhesivelayer 30 is used to protect the bent part of the display panel 10. Asshown in FIG. 2 , since the adhesive has fluidity, after the adhesivefalls into the adhesive coating area CA, a part of the adhesive flowsout of a boundary of the adhesive coating area CA, and the area wherethe adhesive flows out of the adhesive coating area CA is denoted as anoutward expansion area EA. A thickness of the adhesive in the outwardexpansion area EA gradually decreases, and the cured adhesive layer 30is formed as a slope shape in the outward expansion area EA as shown inFIG. 2 .

After the adhesive is cured, the protection film 21 needs to be peeledoff, and if the adhesive flows onto an upper surface of the protectionfilm 21, the cured adhesive layer 30 could be pulled when the protectionfilm 21 is peeled off, so that the cured adhesive layer 30 cannoteffectively protect the bent part of the display panel 10. In FIGS. 1and 2 , a certain distance is left between a starting position of theadhesive coating area CA and the protection film 21, and the distance isgreater than or equal to a size of the outward expansion area CA, sothat the adhesive before being cured can be prevented from flowing ontothe upper surface of the protection film 21, and the cured adhesivelayer 30 can be prevented from being pulled when the protection film 21is peeled off.

After the adhesive is coated and the adhesive is cured as shown in FIG.1 , when the display panel 10 is bent, a certain distance needs to beleft between a starting position of bending and the starting position ofcoating the adhesive, and the distance is determined according to avalue of alignment precision of the adhesive coating device 40, so as toensure that the adhesive on the bent part of the display panel 10reaches a target thickness. After the display panel 10 is bent, a widthS for a frame of the display panel 10 is shown in FIG. 3 , whereS=a+b+c+d; a is a distance between a boundary of the display area AA anda boundary of the protection film 21; b is a distance between thestarting position of coating the adhesive and the protection film 21; cis the value of alignment precision of the adhesive coating device 40; dis the sum of a thickness of the cured adhesive layer 30 on the bentpart of the display panel 10, a thickness of the display panel 10 and abending radius.

In a first aspect, an embodiment of the present disclosure provides adisplay assembly. FIG. 4 a is a top view illustrating a display assemblyaccording to an embodiment of the present disclosure. FIG. 4 b is across-sectional view along a line BB′ in FIG. 4 a. In combination withFIGS. 4 a and 4 b , the display assembly includes: a display panel 10, ablocking layer 20, and a cured adhesive layer 30.

The display panel 10 includes: a screen portion 11, a chip providingportion 13, a bendable portion 12 between the screen portion 11 and thechip providing portion 13, and a spacer portion 14 connected between thebendable portion 12 and the screen portion 11. The cured adhesive layer30 is located outside an area of the screen portion 11, and the curedadhesive layer 30 includes: a first portion 31 covering the bendableportion 12 and a second portion 32 covering the spacer portion 14, thefirst portion 31 and the second portion 32 each having a thickness lessthan a thickness of the blocking layer 20. The second portion 32 is incontact with the blocking layer 20, and in particular, the secondportion 32 is in contact with a side of the blocking layer 20. A surfaceof the second portion 32 of the cured adhesive layer 30 distal to thespacer portion 14 is substantially flat. It is noted that the“substantially flat” means that a difference between a maximum thicknessand a minimum thickness is less than ⅕ of a maximum thickness.

Compared with the embodiment shown in FIGS. 1 to 3 , in the embodimentof the present disclosure, a part of the cured adhesive layer 30 closeto the blocking layer 20 is substantially flat and is not formed as aslope shape, so that when the display panel is bent to form the bendableportion 12 as a curved shape, the display panel can be bent from aposition closer to the screen portion 11, so as to reduce a distancebetween the bendable portion 12 and the screen portion 11, whichfacilitates a narrow frame. Moreover, the cured adhesive layer 30 islocated outside an area of the blocking layer 20, and when the blockinglayer 20 needs to be peeled off subsequently, the cured adhesive layer30 is not pulled, so that it is ensured that the cured adhesive layer 30may effectively protect the bendable portion 12, and a quality of thedisplay assembly is further guaranteed. Consequently, the embodiment ofthe present disclosure can achieve a narrow frame in the case where aquality of the display assembly is further guaranteed. Compared withFIGS. 3 and 4 , a width for a frame of the display assembly provided inthe embodiment of the present disclosure is S′=a+b+c, which is reducedby b than the width for the frame of the display assembly shown in FIG.3 .

In an embodiment, the display panel 10 is a flexible organic lightemitting diode (OLED) display panel. The bendable portion 12 is in abent state, and the chip providing portion 13 is located at a backlightside of the screen portion 11, for bonding driving chips. The backlightside is a side opposite to a light exit direction of the screen portion11.

A width of the spacer portion 14 may be determined according toalignment precision of the adhesive coating device. For example, thewidth c of the spacer portion 14 is in a range of 120 μm to 180 μm.

In an embodiment, a thickness of the first portion 31 of the curedadhesive layer 30 is in a range of 60 μm to 120 μm, so that when thebendable portion 12 is in a bent state, the bendable portion 12 iseffectively protected, and a width for a frame of the display assemblyis prevented from being oversized.

In an embodiment, a thickness of the second portion 32 of the curedadhesive layer 30 is in a range of 60 μm to 90 μm, which facilitates adesired thickness of the first portion 31, and facilitates a reduceddistance between the bendable portion 12 and the screen portion 11.

In an embodiment, a material of the cured adhesive layer 30 includespolyester polyurethane.

In an embodiment, the cured adhesive layer 30 further includes a thirdportion 33 in addition to the first portion 31 and the second portion32, the third portion 33 is provided on the chip providing portion 13,and a thickness of the third portion 33 gradually decreases in adirection away from the bendable portion 12. When the adhesive is coatedonto the display panel 10, the adhesive is coated in a direction fromthe screen portion 11 to the bendable portion 12, and an end positionfor coating is located on the chip providing portion 13, and at the endposition for coating, the adhesive is formed as a shape with a graduallyreduced thickness due to a flow of the adhesive, so that after beingcured, the third portion 33 with a gradually reduced thickness is formedon the chip providing portion 13.

In an embodiment, a surface of the third portion 33 distal to the spacerportion 14 is a bevel. It will be appreciated that the surface of thethird portion 33 distal to the spacer portion 14 may also have othershape, for example, a convex or concave curved surface.

In an embodiment, the cured adhesive layer 30 further includes a fourthportion 34 in addition to the first portion 31, the second portion 32and the third portion 33; the fourth portion 34 is provided on the chipproviding portion 13; the fourth portion 34 is connected between thefirst portion 31 and the third portion 33; a surface of the fourthportion 34 distal to the chip providing portion 13 is substantiallyflat. When the adhesive is coated on the display panel 10, an endposition for coating is located at a joint between the third portion 33and the fourth portion 34, so as to ensure that a thickness of theadhesive coated on the overall bendable portion 12 reaches a requiredthickness.

In an embodiment, the bendable portion 12 is in a bent state, the chipproviding portion 13 is located on a backlight side of the screenportion 11, the blocking layer 20 is provided on a surface of the screenportion 11 distal to the chip providing portion 13, and a first backmembrane 51 is provided on a surface of the screen portion 11 proximalto the chip providing portion 13, and the first back membrane 51 is usedfor protecting the screen portion 11. The second portion 32 of the curedadhesive layer 30 at least partially overlaps the first back membrane 51in a thickness direction of the screen portion 11. When the displaypanel 10 is bent, the bending can be started from a boundary position ofthe first back membrane 51, and the first back membrane 51 at leastpartially overlaps the second portion 32 of the cured adhesive layer 30in a thickness direction of the screen portion 11, so as to ensure thatthe adhesive layer 30 in an area where the bending just starts may reacha required thickness after the bendable portion 12 reaches the bentstate.

It should be noted that, in the embodiment of the present disclosure,two membranes at least partially overlapping with each other in athickness direction of the screen portion 11 (or the chip providingportion 13) means that orthographic projections of the two membranes ona plane perpendicular to the thickness direction of the screen portion11 (or the chip providing portion 13) at least partially overlap witheach other.

In an embodiment, a boundary of the first portion 31 of the curedadhesive layer 30 close to the bendable portion 12 is flush with aboundary of the first back membrane 51 close to the bendable portion 12,so that the first back membrane 51 is located outside an area of thebendable portion 12 to facilitate bending of the bendable portion 12.

In an embodiment, the bendable portion 12 is in a bent state, the chipproviding portion 13 is located on a backlight side of the screenportion 11, the chip providing portion 13 has a first surface distal tothe screen portion 11 and a second surface proximal to the screenportion 11, a part of the cured adhesive layer 30 is located on thefirst surface of the chip providing portion 13, and a second backmembrane 52 is provided on the second surface of the chip providingportion 13. The part of the cured adhesive layer 30 on the first surfaceof the chip providing portion 13 at least partially overlaps the secondback membrane 52 in a thickness direction of the chip providing portion13.

In an embodiment, a heat dissipation layer 60 and a support layer 70 areprovided between the first back membrane 51 and the second back membrane52, and the heat dissipation layer 60 is provided between the supportlayer 70 and the screen portion 11 for dissipating heat of the displaypanel 10. The support layer 70 is used to maintain a certain distancebetween the screen portion 11 and the chip support portion 13, and keepthe bendable portion 12 in a stable bent state. A material of thesupport layer 70 may be polyethylene terephthalate (PET).

In an embodiment, the blocking layer 20 is a protection film, forprotecting the screen portion 11 of the display panel 10 before apolarizer is attached, so as to prevent the display panel 10 from beingcontaminated in other processes before the polarizer is attached. In anembodiment, the blocking layer 20 is a polarizer. The polarizer is acircular polarizer and is used for eliminating an influence of externallight on a display picture.

According to the display assembly of the embodiment of the presentdisclosure, without influencing a product quality of the displayassembly, the bendable portion 12 is caused to be closer to the screenportion 11, which facilitates a narrow frame.

As another aspect of the present disclosure, a display device isprovided, and includes the display assembly in the above embodiments.The display device can be any product or component with a displayfunction such as a mobile phone, a television, a display, a tabletpersonal computer and a navigator, and the display device can achieve anarrow frame.

As a further aspect of the present disclosure, a manufacturing method ofthe display assembly is provided. FIGS. 5 to 10 are schematic diagramsillustrating a manufacturing procedure of the display assembly accordingto an embodiment of the present disclosure, and the manufacturing methodof the display assembly includes the following steps S101 to S104, asshown in FIG. 11 .

Step S101, preparing a display panel 10. As shown in FIG. 5 , thedisplay panel 10 includes: a screen portion 11, a chip providing portion13, a bendable portion 12 between the screen portion 11 and the chipproviding portion 13, and a spacer portion 14 connected between thebendable portion 12 and the screen portion 11. The display panel 10 maybe a flexible organic light emitting diode (OLED) display panel, and thechip providing portion 13 is used for providing driving chips, and thedriving chips may be provided on the chip providing portion 13 bybonding. The screen portion 11 may include: a display area fordisplaying images and a part of a non-display area outside the displayarea.

Step S102, forming a blocking layer 20 on the screen portion 11, asshown in FIG. 6 .

Step S103, forming an adhesive layer with a thickness less than that ofthe blocking layer 20 on the display panel 10. The adhesive layer may beformed by coating, and as shown in FIG. 8 , adhesive 30 a is coated onthe display panel 10 to form the adhesive layer. The adhesive layer is alayer formed when the adhesive coated on the display panel 10 reaches astable state. The adhesive layer is located outside an area of thescreen portion 11 and at least covers the bendable portion 12 and thespacer portion 14, and the adhesive layer is in contact with theblocking layer 20.

In the step S103, the adhesive 30 a may be coated on the display panel10 by using an adhesive coating device 40, and the adhesive coatingdevice 40 is a device having an adhesive outlet, such as a dropper.

Step S104, curing the adhesive layer on the display panel 10. As shownin FIG. 9 , the cured adhesive layer 30 is located outside an area ofthe screen portion 11, and the cured adhesive layer 30 includes: a firstportion 31 covering the bendable portion 12 and a second portion 32covering the spacer portion 14, the first portion 31 and the secondportion 32 each have a thickness less than a thickness of the blockinglayer 20. The cured adhesive layer 30 is in contact with the blockinglayer 20, and in particular, the cured adhesive layer 30 is in contactwith a side of the blocking layer 20. A surface of the second portion 32of the cured adhesive layer 30 distal to the spacer portion 14 issubstantially flat.

In step S104, the adhesive layer may be cured by ultraviolet light.

In the embodiment of the present disclosure, a part of the curedadhesive layer 30 close to the blocking layer 20 is substantially flatwithout forming a slope shape, and therefore, when the display panel isbent such that the bendable portion 12 is formed as a curved shape, thedisplay panel may be bent from a position closer to the screen portion11, reducing a distance between the bendable portion 12 and the screenportion 11, which facilitates a narrow frame. Moreover, because athickness of the blocking layer 20 is greater than that of the curedadhesive layer 30, when the blocking layer 20 needs to be peeled offlater, the cured adhesive layer 30 is not pulled, so that it is ensuredthat the cured adhesive layer 30 may effectively protect the bendableportion 12, and a quality of the display assembly is further guaranteed.Therefore, the manufacturing method provided by the embodiment of thepresent disclosure may achieve a narrow frame in the case where aquality of the display assembly is further guaranteed.

In addition, with the adhesive coating method of the embodiment of thepresent disclosure, it is not required to adjust conditions such as rawmaterials in an adhesive coating process and an alignment precision ofan adhesive coating device, which can reduce a production cost.

In an embodiment, the adhesive is polyester polyurethane (e.g., MCLadhesive).

The manufacturing method provided by the embodiment of the presentdisclosure will be described below with reference to FIGS. 5 to 10 , andthe manufacturing method includes step S101 to step S105, as shown inFIG. 11 .

Step 101, preparing a display panel 10. As shown in FIG. 5 , the displaypanel 10 includes: a screen portion 11, a chip providing portion 13, abendable portion 12 between the screen portion 11 and the chip providingportion 13, and a spacer portion 14 connected between the bendableportion 12 and the screen portion 11. The chip providing portion 13 hasa first surface and a second surface opposite to each other.

Step S102, forming a blocking layer 20 on the screen portion 11, asshown in FIG. 6 .

Step S1021, as shown in FIG. 7 , forming a first back membrane 51 on asurface of the screen portion 11 distal to the blocking layer 20, andforming a second back membrane 52 on the second surface of the chipproviding portion 13; successively forming a heat dissipation layer 60and a support layer 70 on a side of the first back membrane 51 distal tothe screen section 11.

It is noted that the sequential order of step S102 and step S1021 is notparticularly limited, and for example, step S102 may be performed beforestep S1021 or after step S1021.

Step S103, forming an adhesive layer with a thickness less than that ofthe blocking layer 20.

In an embodiment, specifically, step S103 includes: adhesive 30 a iscoated in a direction from the screen portion 11 to the chip providingportion 13 from a position adjacent to the blocking layer 20, to form anadhesive layer. In this way, after the adhesive layer is cured, arequired thickness may be achieved at a position adjacent to theblocking layer 20, so as to minimize a distance between a start positionfor bending of the bendable portion 12 and the screen portion 11,thereby reducing a width of the frame, to an extreme.

An alignment error of the adhesive coating device 40 at a start positionfor coating is small compared to an end position for coating, andtherefore, when the adhesive is applied in a direction from the screenportion 11 to the chip providing portion 13, it is advantageous tocontrol a thickness and position of an end of the adhesive layer closeto the blocking layer 20.

Step S104, curing the adhesive layer on the display panel 10. As shownin FIG. 9 , the cured adhesive layer 30 is located outside an area ofthe screen portion 11, and the cured adhesive layer 30 includes: a firstportion 31 covering the bendable portion 12 and a second portion 32covering the spacer portion 14, the first portion 31 and the secondportion 32 each have a thickness less than a thickness of the blockinglayer 20. The cured adhesive layer 30 is in contact with the blockinglayer 20, and in particular, the cured adhesive layer 30 is in contactwith a side of the blocking layer 20. A surface of the second portion 32of the cured adhesive layer 30 distal to the spacer portion 14 issubstantially flat.

In an embodiment, the second portion 32 of the cured adhesive layer 30at least partially overlaps the first back membrane 51 in a thicknessdirection of the screen portion 11.

In an embodiment, in step S103, the end position for coating is locatedon the chip providing portion 13. In this case, a part of the curedadhesive layer 30 is located on the first surface of the chip providingportion 13, and the part of the cured adhesive layer 30 on the firstsurface of the chip providing portion 13 at least partially overlaps thesecond back membrane 52 in a thickness direction of the chip providingportion 13.

In an embodiment, the cured adhesive layer 30 further includes a thirdportion 33 provided on the chip providing portion 13 in addition to thefirst portion 31 and the second portion 32, and a thickness of the thirdportion 33 gradually decreases in a direction away from the bendableportion 12.

In an embodiment, the cured adhesive layer 30 further includes a fourthportion 34, in addition to the first portion 31, the second portion 32and the third portion 33, the fourth portion 34 is provided on the chipproviding portion 13, the fourth portion 34 is located between the firstportion 31 and the third portion 33, and a surface of the fourth portion34 distal to the chip providing portion 13 is substantially flat. Whenthe adhesive is coated on the display panel 10, an end position forcoating is located at a joint between the third portion 33 and thefourth portion 34, so as to ensure that a thickness of the adhesivecoated on the overall bendable portion 12 reaches a required thickness.

In an embodiment, a thickness of the adhesive layer on the bendableportion 12 is in a range of 60 μm to 120 μm, so that the cured adhesivelayer 30 may effectively protect the bendable portion 12.

Step S105, as shown in FIG. 10 , bending the display panel 10 along thebendable portion 12, so that the chip providing portion 13 is located atthe backlight side of the screen portion 11, and the bendable portion 12is in a bent state. At this time, the first surface of the chipproviding portion 13 is distal to the screen portion 11, and the secondsurface of the chip providing portion 13 is proximal to the screenportion 11.

In an embodiment, the blocking layer 20 is a protection film, such as atemporary protection film (TPF), which is used to protect the screenportion 11 of the display panel 10 before a polarizer is attached, andto prevent the display panel 10 from being contaminated in otherprocesses before the polarizer is attached. The protection film may be apolyethylene film. In this case, the protection film may be peeled offafter step S104, and then the polarizer may be attached on the screenportion 11 of the display panel 10. The polarizer is a circularpolarizer and is used for eliminating an influence of external light onthe display picture.

In an embodiment, the blocking layer 20 is a polarizer. Since thepolarizer is not required to be peeled off, when the blocking layer 20is a polarizer, even if a small amount of adhesive is coated to thepolarizer, the cured adhesive layer 30 is not pulled.

It will be understood that, the above embodiments are merely exemplaryembodiments employed to illustrate the principles of the presentdisclosure, but the present disclosure is not limited thereto. It willbe apparent to those skilled in the art that various changes andmodifications may be made therein without departing from the spirit andscope of the present disclosure, and these changes and modifications areto be considered within the scope of the present disclosure.

1. A display assembly, comprising: a display panel, comprising: a screenportion, a chip providing portion, a bendable portion between the screenportion and the chip providing portion, and a spacer portion between thebendable portion and the screen portion; a blocking layer on the screenportion; a cured adhesive layer outside an area of the screen portionand comprising: a first portion covering the bendable portion and asecond portion covering the spacer portion, the first portion and thesecond portion each having a thickness less than that of the blockinglayer, wherein the second portion is in contact with the blocking layer,and a surface of the second portion distal to the spacer portion issubstantially flat.
 2. The display assembly of claim 1, wherein thecured adhesive layer further comprises a third portion on the chipproviding portion, and a thickness of the third portion is graduallyreduced along a direction far away from the bendable portion.
 3. Thedisplay assembly of claim 2, wherein a surface of the third portiondistal to the spacer portion is a bevel.
 4. The display assembly ofclaim 2, wherein the cured adhesive layer further comprises a fourthportion on the chip providing portion, the fourth portion is connectedbetween the first portion and the third portion, and a surface of thefourth portion distal to the chip providing portion is substantiallyflat.
 5. The display assembly of claim 1, wherein the bendable portionis in a bent state, and the chip providing portion is on a backlightside of the screen portion.
 6. The display assembly of claim 5, whereinthe blocking layer is on a surface of the screen portion distal to thechip providing portion, a first back membrane is provided on a surfaceof the screen portion proximal to the chip providing portion, and thesecond portion of the cured adhesive layer at least partially overlapsthe first back membrane in a thickness direction of the screen portion.7. The display assembly of claim 6, wherein a boundary of the firstportion of the cured adhesive layer close to the bendable portion isflush with a boundary of the first back membrane close to the bendableportion.
 8. The display assembly of claim 5, wherein the chip providingportion has a first surface distal to the screen portion and a secondsurface proximal to the screen portion, a part of the cured adhesivelayer is on the first surface of the chip providing portion, a secondback membrane is on the second surface of the chip providing portion,and the part of the cured adhesive layer on the first surface of thechip providing portion at least partially overlaps the second backmembrane in a thickness direction of the chip providing portion.
 9. Thedisplay assembly of claim 1, wherein a thickness of the first portion ofthe cured adhesive layer is in a range of 60 μm to 120 μm.
 10. Thedisplay assembly of claim 1, wherein the second portion of the curedadhesive layer has a thickness in a range of 60 μm to 90 μm.
 11. Thedisplay assembly of claim 1, wherein the blocking layer is a protectionfilm.
 12. The display assembly of claim 1, wherein the blocking layer isa polarizer.
 13. A display device comprising the display assembly ofclaim
 1. 14. A manufacturing method of a display assembly, comprising:preparing a display panel, the display panel comprising: a screenportion, a chip providing portion, a bendable portion located betweenthe screen portion and the chip providing portion, and a spacer portionconnected between the bendable portion and the screen portion; forming ablocking layer on the screen portion; forming an adhesive layer on thedisplay panel; curing the adhesive layer, wherein the cured adhesivelayer is located outside an area of the screen portion, and the curedadhesive layer comprises: a first portion covering the bendable portionand a second portion covering the spacer portion, the first portion andthe second portion each having a in thickness less than that of theblocking layer, wherein the second portion is in contact with theblocking layer, and a surface of the second portion distal to the spacerportion is substantially flat.
 15. The manufacturing method of claim 14,wherein the forming an adhesive layer on the display panel comprises:coating adhesive along a direction from the screen portion to the chipproviding portion, starting from a position adjacent to the blockinglayer, to form the adhesive layer.
 16. The manufacturing method of claim15, wherein the coating adhesive along a direction from the screenportion to the chip providing portion comprises coating adhesivestarting from the position adjacent to the blocking layer to an endposition located on the chip providing portion such that the curedadhesive layer further comprises a third portion on the chip providingportion, and a thickness of the third portion is gradually reduced alonga direction far away from the bendable portion.
 17. The manufacturingmethod of claim 16, wherein the cured adhesive layer further comprises afourth portion provided on the chip providing portion, the fourthportion is connected between the first portion and the third portion, asurface of the fourth portion distal to the chip providing portion issubstantially flat.
 18. The manufacturing method of claim 14, whereinthe curing the adhesive layer further comprises: bending the displaypanel along the bendable portion such that the chip providing portion islocated on a backlight side of the screen portion, and the bendableportion is in a bent state.
 19. The manufacturing method of claim 18,wherein before the bending the display panel along the bendable portion,the method further comprises: forming a first back membrane on a surfaceof the screen portion distal to the blocking layer, wherein the secondportion of the cured adhesive layer at least partially overlaps thefirst back membrane in a thickness direction of the screen portion. 20.The manufacturing method of claim 18, wherein a part of the curedadhesive layer is located on a first surface of the chip providingportion, before the bending the display panel along the bendableportion, the method further comprises: forming a second back membrane ona second surface of the chip providing portion, wherein the curedadhesive layer on the first surface of the chip providing portion atleast partially overlaps the second back membrane in a thicknessdirection of the chip providing portion; the bending the display panelalong the bendable portion comprises bending the display panel along thebendable portion such that the first surface of the chip providingportion is distal to the screen portion, and the second surface of thechip providing portion is proximal to the screen portion.